Thermal Analysis  


Electronics Packaging

From the Flow results we can create expected operating temperatures typically defining heat-sink geometry including ‘heat-pipes’ and monitoring the junction temperatures of the key components.

Thermal management of the whole system is essential to the development of reliable products and we have many years experience determining solutions of how to manage the cooling air flow around enclosures using baffles and chassis design to determine a successful product





All PTC Logos are used under license from Parametric Technology Corporation, Needham, MA, USA. 

All CFdesign logos are used under license from Blue Ridge Numerics USA

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