| Thermal Analysis |
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Electronics Packaging From the Flow results we can create expected operating temperatures typically defining heat-sink geometry including ‘heat-pipes’ and monitoring the junction temperatures of the key components. Thermal management of the whole system is essential to the development of reliable products and we have many years experience determining solutions of how to manage the cooling air flow around enclosures using baffles and chassis design to determine a successful product |
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All PTC Logos are used under license from Parametric Technology Corporation, Needham, MA, USA. All CFdesign logos are used under license from Blue Ridge Numerics USA Copyright © 1998 - 2012 Haydndesign Limited. |
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