| Electronics Packaging | |||
A selection of images
from recent projects,
primarily
showing:
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| 19" rack design | |||
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19" rack system -
our involvement included the full mechanical design and integration of
the electrical and environmental requirements of the specification.
Ensuring strict adherence to the the EMC requirements and structural
integrity of a large 8U bespoke system including full thermal management
was critical.
New mechanisms were developed for manual access of line cards and fan modules, working with manufactures and end users to ensure that performance of these key build and maintenance operations were as good or better than the marketplace. |
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| Rugged Enclosures | |||
| Working with Richard Bush Limited allowed us to develop a new enclosure for a GPS mapping system. It included a novel approach to producing a low volume product that looked and felt modern and rugged without the huge investment usually associated with this type of professional product. |
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| BDL Broadcasting equipment | |||
| Here we worked with BDL, an established supplier to the broadcasting industry, re-developing the identity of their product and put in place a family design, where the products kept their roots but were able to deliver many sizes of device, using a cost effective design |   |
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| AGFA An industrial duplex A3+ electrostatic printer | |||
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Here the project included paper path definition R & D test machine design, and the liaison with Japanese subcontract engineers to incorporate best in class paper handling. Several Patents were issued during this development project. |
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